Semi-conductor Laboratory
20 June 2021,  08:58  IST   
 
 

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Tender No: SCL/PS/2021E0196801 Tender Ref. Date: 28-04-2021
Tender Type: Public Tender Currency: INR
Description: 6inch SOI & DSP Silicon Wafers
No. of Material: 4 Tender Mode: Multi Part
Division: Purchase& Stores Purchase Entity: -
Remark: In e-procurement system submission of bid is a two-step process. After submission of their bids, bidders have to wait for bid sealing by Purchaser. Subsequently, bidders have to complete open authorization in the e-procurement system to enable the Purchaser to open the bid. If open authorization is not completed by the bidder, then Purchaser will not be able to open the bid and the bid becomes invalid.
In case bidder encounters any technical snag pertaining to e-procurement system while acting on the tender, computer screen shot of the error message with date & time stamp on the web-browser along with the query shall be e-mailed by the bidder to the help desk, for resolution of the problem, at least 2 working days before the due date and time of bid submission. The contact detail of the help desk is available on the home page of the e-procurement website.
Purchaser will make all efforts to resolve technical queries reported by the bidders but will not be bound to do so if the problems are reported beyond the time mentioned above. Purchaser will not be responsible for non-submission of bids for such cases.
The time taken to ascertain, evaluate and suggest a solution for the problem reported by bidder may vary from case to case. Hence bidders are advised to submit the bid well in advance before closing date and time to avoid last minute issues.
Officer Name: scl_po1 Officer Designation: Sr. Purchase and Stores Officer
Notice Text
E-Procurement Tender No. SCL/PS/2021E0196801 dated 28.04.2021 SEMI-CONDUCTOR LABORATORY [SCL] invites ONLINE offers in TWO part system through e-tender portal https://eprocure.isro.gov.in for 6inch SOI & DSP Silicon Wafers. Tender documents can be downloaded from 07.05.2021 - 1101 hrs. to 27.05.2021 upto 1430 hrs. The vendors need to get enrolled in the e-tender portal to access tender and submit their offer online. Vendors need to have Digital Signature Certificate as detailed on our e-portal and corporate e-mail ID to register on the above portal. Only online tenders will be accepted. No Manual/Postal/ courier/ e-mail/fax tender will be entertained. Please note Tender fee shall not be applicable for tenders submitted on-line through this portal. Vendors interested to participate in this e-Tender are required to register themselves as vendors, if not already registered, in our e-procurement portal https://eprocure.isro.gov.in by downloading plugins and help demos listed on the home page of the e-procurement link mentioned above to complete the vendor registration process. They can seek help from help desk 020 25315555 / 9167969601 (Email: support.isro@nextenders.com) also the home page of e-procurement portal may be accessed for any technical help for registration and subsequent process. Vendors may please note that without registering in our E-procurement portal they will not be able to quote for this tender.
Tender Common Templates
Instructions to Tenderers (PT) | DOS PM 20
Materials
Sr No Item Description Unit Of
Measurement
Quantity
1 6 inch SOI Wafers High Conductive N-type (Phosphorus/Arsenic doped) SOI Wafer 50 +/- 1 micron with 3micron Buried Oxide, SCL Code: 210211205 No. 50
2 6 inch SOI Wafers N-type(Phosphorus/ Arsenic doped) SOI wafer 10 +/- 1 micron, SCL Code: 212211081 No. 25
3 6 inch SOI Wafers N-type (Phosphorus/ Arsenic doped) SOI Wafer 50 +/- 1 micron, SCL Code: 212211017 No. 25
4 N Type DSP Prime Wafers 6inch N Type Double Side Polished Silicon Prime Wafers, SCL Code: 211211027 No. 250
Fee Structure
SrNo Stage Amount (Rs.)
2 Bid Submission 218
Schedule
Seq No Buyer Stage Supplier Stage Start Date & Time Expiry Date & Time
1 Tender Release - 06-05-2021 10:00 07-05-2021 11:00
2 - Tender download 07-05-2021 11:01 27-05-2021 14:30
3 - Bid Submission 07-05-2021 11:02 27-05-2021 15:00
4 Bid Sealing - 27-05-2021 15:01 28-05-2021 15:30
5 - Open Authorisation 28-05-2021 15:31 17-06-2021 14:30
6 Tender Opening - 17-06-2021 14:31 18-06-2021 17:30
7 Tender Evaluation - 17-06-2021 14:32 31-07-2021 17:30
8 Price Bid Opening - 19-06-2021 10:00 31-07-2021 17:30
9 Price Bid Evaluation - 19-06-2021 10:01 31-07-2021 17:30
10 PO Release - 20-06-2021 10:00 31-07-2021 17:30